Silicone & Nanocomposite

Addition Curing Silicone

They can be used at temperatures between -60°C and 200°C, specialties even beyond these limits. They are formulated without using plasticisers and without tin compounds. Their curing mechanism allows the vulcanization of unlimited layer thickness in one step. Volume shrinkage is virtually zero as no cleavage products are liberated.

Condensation Curing Silicone

Mechanical properties of condensation curing systems can be adjusted over a wide specification range. They have a universal adhesion profile and are highly resistant to temperature changes, UV radiation, and chemical attack. Condensation silicones can be formulated without plasticizers and without tin.

Reactive Resin Modifiers

Nanocomposites

Dispersions of nano-scale SiO2 particles enable the formulation of transparent products with low viscosity and high filler content that do not show any sedimentation. This process uses surface-modified, agglomerate-free silica particles with a diameter of approx. 20 nm.

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